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Machines and materials for PCB assembly

 

Automated 3D Solder Paste Inspection system (SPI)

 

Vi TECHNOLOGY

3D-SPI-PI 3D-SPI-PI

Vi TECHNOLOGY ®'s 3D-SPI is
the world's first 3D Solder paste
inspection system able to measure
PCB warp as well as true solder volume
without shadow effect within cycle time.
On-the fly 3D image acquisition (instead
of stop and move) brings faster 3D
inspection without loss of resolution.
S-100 Data Import S-100 Data Import

σ Import (s-100) is part of SIGMA Link,
a web-based software suite to drive
SMT process and build knowledge.
The Data Import module generates a
iCAD file from Gerber and CAD x,y.
The machine programming time is
step is drastically reduced thanks to the
panel layout definition, easy data import,
panelization, and fiduciall settings.