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Machines and materials for PCB assembly

 

Vapor Phase Soldering ovens

 

ASSCON

VP310 VP 310

The main target areas of application
for the vapor phase soldering system
VP 310 series are labs, and prototype
and small series manufacturing operations.
Due to the compact dimensions and the fact
that no stationary supply systems are
needed for operation, it is perfect for
trouble-free application at many different sites.
 
 VP 510 VP 510

The VP 510 Series is designed to be used in
the laboratory and for prototype production.
Due to its compact design and optionally
an integrated cooling unit the machine may
be used at any place and without preparatory
set-up even at different workplaces.
ASSCON VP 3000 inline VP 800

The ASSCON VP800 system has been
developed especially for laboratories and
prototyping. Thanks to its multi-chamber
design, the system can also be used for
implementing close-to-production process
qualifications. Moreover, the system can be
used for soldering very small series.



ASSCON VP 3000 inline VP 800 Vacum

ASSCON’s vacuum soldering process
combines the advantages of the vapourphase
with the vacuum process.
Typical Applications:
* Soldering of cased power components on
printed circuit boards
* Soldering of 3D assemblies
* Making solder connections of large area
electrical and mechanical components
* Reflowing of large area SMDs or connectors
on multi-layers
* Repair of SMDs or conventional connectors
in high-count multi-layers
* Hermetic soldering of high frequency
penetrations
* Elimination of voids with through-holes or
other leaded connections for components to
improve heat sinking
VP1000 VP 1000

The ASSCON VP1000 s are particularly suited
for users who process product with frequently
changing assemblies in small and medium
sized quantities. Universal workpiece carriers
make the systems very flexible.
Advantages:
* Economical soldering system for highest
technological requirements and testing of
soldering processes
* Oxidation-free pre-heat and soldering process
* Homogeneous temperature distribution on the
whole assembly
* Overheating of the solder product is impossible
* No shadowing or color selectivity
* Reproducible process conditions
* No time-consuming for generation of
temperature profiles
of components
* Low operating costs
* Universally useable for series and individual
operation		 VP6000 VP 6000 Vacum

ASSCON’s vacuum soldering process
combines the advantages of the vapourphase
with the vacuum process.
Typical Applications:
* Soldering of cased power components on
printed circuit boards
* Soldering of 3D assemblies
* Making solder connections of large area
electrical and mechanical components
* Reflowing of large area SMDs or connectors
on multi-layers
* Repair of SMDs or conventional connectors
in high-count multi-layers
* Hermetic soldering of high frequency
penetrations
* Elimination of voids with through-holes or
other leaded connections for components to
improve heat sinking
* Area reflowing of components on
heat-sink planes
VP 2000 VP 2000

ASSCON vapor phase reflow soldering systems
set standards in soldering technology. The VP 2000
inline series are based on advanced patented high-tech
soldering methods, and offer outstanding soldering quality
in large series production.
* reproducible process conditions
* low energy costs thanks to smart energy management
* low overall running costs
* full traceability capability
* product changing without waiting times
* dual lane conveying for particularly high processing rates
  VP 7000 VP 7000

The innovative inline soldering system for large series users
is equipped with the patented Multi Vacuum technology.
In the Multi Vacuum soldering process products are placed
under a vacuum both before and during melting of the
solder paste.


ASSCON also offer other models with better specifications and higher throughput, which you can find at www.asscon.de or contact us for more details.