Kester
USA
Kester was founded in 1899. It specializes in the production of soldering materials.
More information about Kester's products can be found at https://www.kester.com/.
Products from Kester
NP545
KESTER NP545 is a lead-free No Clean solder paste with a wide range of applications. Available in particle sizes 15-25 µm (Class 5), 20-38 µm (Class 4) and 25-45 µm (Class 3). Delivered in 500gr. jars or 600gr. cartridges.
Solder paste
Kester
959T
Kester 959T is a no-clean, non-corrosive, liquid flux with low solids content that is designed for wave soldering of trough hole and surface mount circuit board assemblies. Delivered in 25l cans.
Flux
Kester
2220-VF
KESTER 2220-VF is a water based liquid flux without volatile organic components (VOC free) designed for lead-free automated wave solder applications. Delivered in 25l cans.
Flux
Kester
2235
KESTER 2235 is a water soluble liquid flux on an alcohol basis without volatile organic components (VOC free). Delivered in 25l cans.
Flux
Kester
SELECT-10
KESTER SELECT-10 is a No Clean alcohol-based liquid flux designed for use in selective soldering. Delivered in 5l cans.
Flux
Kester
TSF6592
Kester TSF-6592 is a no-clean paste flux designed as a solution for a range of lead-free applications such as rework/repair of CSP's, BGA's, SMD's, flip chip attach, sphere or ball attach or any lead-free soldering application that requires a very tacky flux. Delivered in 10 gr. syringes.
Flux
Kester
985M
KESTER 985M is a No Clean alcohol-based liquid flux with a high activity and wide range of application. Delivered in 25l cans.
Flux
Kester
952S
KESTER 952S is a No Clean alcohol-based liquid flux is primarily designed for use in tabber and stringer equipment of Photovoltaic Assembly (PV) module industry. Delivered in 25l cans.
Flux
Kester
245
Kester 245 is a No Clean leaded solder wire with metal content Sn63Pb37, flux content of 1.1% or 2.2%, on spools of 500 gr. and is available in the following diameters - 0.4mm; 0.6mm; 0.8mm; 1.0mm and 1.2mm.
Solder wire
Kester
275 К100LD
Kester 275 is a No Clean lead-free solder wire with metal content Sn99.3 Cu0.7, flux content of 3.3%, on spools of 500 gr. and is available in the following diameters - 0.4mm; 0.6mm; 0.8mm; 1.0mm and 1.5mm.
Solder wire
Kester
275 SAC305
Kester 275 is a No Clean lead-free solder wire with metal content Sn96.5 Ag3 Cu0.5, flux content of 2.2%, on spools of 500 gr. and is available in the following diameters - 0.4mm; 0.6mm; 0.8mm; 1.0mm and 1.5mm.
Solder wire
Kester
EP256
KESTER EP256 is a leaded No Clean solder paste. Available in particle sizes 20-38 µm (Class 4) and 25-45 µm (Class 3). Delivered in 500gr. jars and 600gr. cartridges.
Solder paste
Kester
Sn63Pb37
Leaded solder. Delivered in 1 kg. bars with metal content - Sn63Pb37.
Solder bar
Kester
K100 LD
Lead-free solder. Delivered in 1 kg. bars with metal content - Sn99.3 Cu0.7.
Solder bar
Kester
SAC305
Lead-free solder. Delivered in 1 kg. bars with metal content - Sn96.5 Ag3 Cu0.5.
Solder bar
Kester
Publications by Kester
Soldering
Kester
Lead-free Wave Soldering
As lead-free gains momentum, many engineers are striving to set-up a wave solder process that maintains production yields but also offer reliable assemblies. Much has been written on these topics in the past 5 years. Less confusion does exist today about alloy choices available to replace leaded solders, however many are struggling with their successful implementation. Once the lead-free alloy is selected, a solid understanding of its chemical and physical properties is required to enable reliable soldering.
Find out more
Soldering
Kester
SMT process recommendations
This paper will discuss commonly experienced defects associated with NoClean surface mount processes and propose methods to solve these issues. Much of the discussion can be applied to any surface mount process (i.e. water soluble, RMA, or No-Clean), but some are directly associated with No-Clean processes.
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Soldering
Kester
Smart chemistry towards highly efficient soldering material formulation
Driven by environmental and health concerns, the RoHS legislation has mandated the electronic assembly industry to transition from eutectic tin-lead to lead-free soldering, which carries forward a revolution in the formulation of soldering materials.
Find out more