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VP 810 Vacuum
Stand alone vapor phase machine for small volume production. PCB’s are soldered at the same time placed on a carrier with dimensions 480 x 295 mm. With the patented Multi Vacuum technology, voids in solder joints are reduced and void rates <1% are achievable. The vacuum module, which can be switched on during the process, is located outside the soldering area (Clean Vacuum Technology) and therefore requires very little maintenance.
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Desoldering system
The ASSCON desoldering system for use in vapor phase soldering systems. Multi-pole SMD components, ball grid arrays, connector strips as well as mechanical elements can be desoldered gently and safely.
Vapor phase soldering
ASSCON
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VP 2000
Inline vapor phase machine for high volume production. Available in single or dual lane configuration with Max. solder length 1500 mm.
Vapor phase soldering
ASSCON
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VP 2100 Vacuum
Inline vapor phase machine for medium volume production. Works with Max. solder format 620 x 520 mm. When voids reduction is required, vacuum is applied during the soldering process.
Vapor phase soldering
ASSCON