Multivacuum – the future of soldering

The applications of the future will call for electronic assemblies of the highest efficiency. Electromobility, regenerative energies, aerospace, medical and military applications – they all demand top performance from their electronic components. Without an optimal connection of the components which allows for maximum performance whilst simultaneously conducting any generated heat away, meeting these requirements can no longer be assured. The component and connection geometries have already undergone significant change and will also continue to change in future. Power electronics assemblies require correspondingly large connecting pads. But in addition to this they also call for void-free solder joints if the assembly is to achieve maximum efficiency. This makes the task of ensuring void-free solder joints in vacuum soldering processes all the more difficult. The increasing demands placed on the electronic assemblies of the future run directly parallel to the call for maximum fail-safety. The applications of future electronic assemblies will come to include more and more central areas of daily supplies such as, for example, the power supply by means of regenerative energies, or electromobility. The failure of electronic assemblies is no longer acceptable here. Productivity and security ofsupply are subject to maximum requirements. Whereas voids in solder joints present a considerable risk of failure. To avoid them will hence be one of the main targets for the soldering process of the future