Top-Loader vapor phase machine for prototypes and small volume batch production. PCB’s are soldered at the same time placed on a carrier with dimensions 450 x 450 mm.

Stand alone vapor phase machine for medium to high volume production. PCB’s are soldered at the same time placed on a carrier with dimensions 600 x 600 mm. When voids reduction is required, vacuum is applied during the soldering process.

Stand alone vapor phase machine for small volume production. PCB’s are soldered at the same time placed on a carrier with dimensions 610 x 460 mm.

Stand alone vapor phase machine for small volume production. PCB’s are soldered at the same time placed on a carrier with dimensions 480 x 295 mm. When voids reduction is required, vacuum is applied during the soldering process.

Inline vapor phase machine for medium volume production. Works with Max. solder format 750 x 620 mm. and Max. component height 60 mm.

Inline vapor phase machine for medium volume production. Works with Max. solder format 620 x 520 mm. When voids reduction is required, vacuum is applied during the soldering process.

Inline vapor phase machine for high volume production. Available in single or dual lane configuration with Max. solder length 1500 mm.

The ASSCON desoldering system for use in vapor phase soldering systems. Multi-pole SMD components, ball grid arrays, connector strips as well as mechanical elements can be desoldered gently and safely.