ASSCON
Германия
ASSCON е основана през 1995 г. Специализирана е в производството на машини за спояване на печатни платки в среда с кондезиращи пари.
Повече информация за продуктите на ASSCON може да намерите на https://www.asscon.de/en/.
Продукти на ASSCON
Desoldering system
The ASSCON desoldering system for use in vapor phase soldering systems. Multi-pole SMD components, ball grid arrays, connector strips as well as mechanical elements can be desoldered gently and safely.
Пещи с кондензиращи пари
ASSCON
VP 2000
Inline vapor phase machine for high volume production. Available in single or dual lane configuration with Max. solder length 1500 mm.
Пещи с кондензиращи пари
ASSCON
VP 2100 Vacuum
Inline vapor phase machine for medium volume production. Works with Max. solder format 620 x 520 mm. When voids reduction is required, vacuum is applied during the soldering process.
Пещи с кондензиращи пари
ASSCON
VP 2100
Inline vapor phase machine for medium volume production. Works with Max. solder format 750 x 620 mm. and Max. component height 60 mm.
Пещи с кондензиращи пари
ASSCON
VP 810
Stand alone vapor phase machine for small volume production. PCB’s are soldered at the same time placed on a carrier with dimensions 610 x 460 mm.
Пещи с кондензиращи пари
ASSCON
VP 6100
Stand alone vapor phase machine for medium to high volume production. PCB’s are soldered at the same time placed on a carrier with dimensions 600 x 600 mm. When voids reduction is required, vacuum is applied during the soldering process.
Пещи с кондензиращи пари
ASSCON
VP 510
Top-Loader vapor phase machine for prototypes and small volume batch production. PCB’s are soldered at the same time placed on a carrier with dimensions 450 x 450 mm.
Пещи с кондензиращи пари
ASSCON
VP 810 Vacuum
Stand alone vapor phase machine for small volume production. PCB’s are soldered at the same time placed on a carrier with dimensions 480 x 295 mm. When voids reduction is required, vacuum is applied during the soldering process.
Пещи с кондензиращи пари
ASSCON
Публикации от ASSCON
Спояване с кондензиращи пари
ASSCON
Simple, efficient, safe - vapor phase soldering
Vapor phase soldering is the ideal process for modern soldering technology. Electronic assemblies can be soldered faultlessly in each configuration. Easy and flexible adjustable temperature gradients assure for each product the optimal, absolutely reproducible temperature profile. No complex test series and line set-up times – applicable from prototype up to serial production.
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Спояване с кондензиращи пари
ASSCON
Electronic manufacturing for less than 2EUR/h
Vapor phase reflow soldering systems set standards in the soldering technology. Vapor as energy transfer medium is one of the most efficient procedures for the heating of assemblies. The efficiency is much higher than with the heating of convection. Through the use of a special liquid GALDEN, an oxygen-free atmosphere is created, where the whole pre-heating and soldering process is running oxidation-free.
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Спояване с кондензиращи пари
ASSCON
Vapour Phase - Secure Lead Free Process
Due to the switch to lead-free manufacturers are faced with multiple new challenges. Simple processing, successful soldering for various products, high quality and user-friendliness are the basic requirements that current soldering systems have to provide. Vapor phase soldering meets these demands. However, individual systems vary greatly when looking at important details
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