3Si Series
Saki’s high-speed, high-precision 3D-SPI automatic inline machines specialize in the inspection of SMT solder processes. Saki's 3Si series are available with PCB clearance (Top/Bottom) – 40mm/60mm and Camera resolution of 12 μm or 18 μm. The 3D-SPI machines inspect and analyze a wide range of potential problem points, including the measurement of solder paste area, height, and volume as well as bridge, solder horn, and BGA coplanarity compliance. The quality of the entire production line is ensured through machine-2-machine co-ordination with solder printing and pick-and-place machines.
Подобни продукти
PI Pico
Automatic inline high accuracy and repeatability 3D SPI with auto-programming and a 80 Mpixel Camera, 12-bit CMOS sensor.
3D Инспекция на паста (SPI)
MYCRONIC
PI Primo
Automatic inline high accuracy and repeatability 3D SPI with auto-programming and a 160 Mpixel Camera, 12-bit CMOS sensor.
3D Инспекция на паста (SPI)
MYCRONIC