A Comparison of Methods for Attaching Thermocouples to Printed Circuit Boards for Thermal Profiling
Спояване
27/10/2024
It was found that of the three alternative methods for attaching thermocouples to PCB’s, none are as repeatable as high temperature solder. This was not a surprise.What was a pleasant surprise was the reliability and repeatability of aluminum tape. Aluminum tapes offers users of pass-through profilers a simple, inexpensive, and nondestructive method of attaching thermocouples to PCBs for thermal profiling. Using Aluminum tape reduces the amount of effort and expense required to obtain a accurate thermal profile, and this is a step forward in terms of both quality control and yield for SMT manufacturers.
Към оригинала на публикацията
Към оригинала на публикацията
Други публикации
Спояване
HELLER Industries
Void Reduction in Bottom Terminated Components Using Vacuum Assisted Reflow
Pockets of gas, or voids, trapped in the solder interface between discrete power management devices and circuit assemblies are, unfortunately, excellent insulators, or barriers to thermal conductivity. This resistance to heat flow reduces the electrical efficiency of these devices, reducing battery life and expected functional lifetime of electronic assemblies.
Разберете повече
Спояване
Kester
The Nature of White Residue on Printed Circuit Assemblies
The problem is not limited only to rosin fluxes and solvent cleaning, but also occurs when water soluble fluxes are used and when either flux type is removed with water. The soldering and cleaning processes involve so many chemicals in the flux, circuit board, components and cleaning agents that a complete understanding of the reactions is very difficult if not impossible. There are white residue problems with water soluble fluxes and many of the causes not related to the flux compositions are the same as for rosin fluxes.
Разберете повече
Спояване
Kester
SMT process recommendations
This paper will discuss commonly experienced defects associated with NoClean surface mount processes and propose methods to solve these issues. Much of the discussion can be applied to any surface mount process (i.e. water soluble, RMA, or No-Clean), but some are directly associated with No-Clean processes.
Разберете повече