Multivacuum – the future of soldering
Vapor phase soldering
21/1/2025
The multivacuum soldering process gives the answer to the challenges of future products and is another milestone from ASSCON in the vacuumsoldering technology. It overcomes the limits of modern soldering processes and starts the future of electronic assembling. See for yourself and get convinced of the results that can be achieved with this process!
To the original publication
To the original publication
Other publications
Vapor phase soldering
ASSCON
Void-free soldering with a new vapor-phase with vacuum technology
Voids in solder joints are largely a function of differential pressure between vapor pressure of the gases inside of the joint and environmental conditions. By entering joints still in their liquid state into decompression chambers, voids can be eliminated.
Find out more
Vapor phase soldering
ASSCON
Vapour Phase - Secure Lead Free Process
Due to the switch to lead-free manufacturers are faced with multiple new challenges. Simple processing, successful soldering for various products, high quality and user-friendliness are the basic requirements that current soldering systems have to provide. Vapor phase soldering meets these demands. However, individual systems vary greatly when looking at important details
Find out more
Vapor phase soldering
ASSCON
Vapour Phase Process
The modern production of electronic assemblies in SMD-technology is unthinkable without the efficient printing process, placement process and particularly the soldering technology. In particular, for a high and constant product quality the soldering technology is of utmost importance. From the start of the SMD-technology there have been two processes competing constantly with each other.
Find out more