Multivacuum – the future of soldering

Voids in solder joints are largely a function of differential pressure between vapor pressure of the gases inside of the joint and environmental conditions. By entering joints still in their liquid state into decompression chambers, voids can be eliminated.

Vapor phase soldering is the ideal process for modern soldering technology. Electronic assemblies can be soldered faultlessly in each configuration. Easy and flexible adjustable temperature gradients assure for each product the optimal, absolutely reproducible temperature profile. No complex test series and line set-up times – applicable from prototype up to serial production.

Back in 1999 ASSCON’s invention of the worldwide first vapour phase vacuum soldering process has already set a milestone for industrial electronic production. The vacuum soldering process proofed as a successful solution for constantly challenging soldering tasks while process windows were getting continuously smaller. The rising number of vapour phase vacuum soldering systems in the electronic industry proofs the essential impact of this vacuum soldering process.