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Void Reduction in Bottom Terminated Components Using Vacuum Assisted Reflow

Soldering
HELLER Industries
23/1/2025

The use of a vacuum chamber in an in-line convection reflow oven has the potential to reduce voiding significantly in largearea pads designed to draw heat away from power semiconductors. This allows for more effective heat dissipation, less heatgeneration, longer battery life and more reliable assemblies.Using 20 torr of vacuum and 30 seconds of dwell time was sufficient to cause this significant reduction in voiding. Sixtysecond dwell in the vacuum showed no additional (significant) decrease in the level of voiding observed. Likewise, reducingthe atmospheric pressure from 20 torr to 5 torr did not show a measureable improvement in void reduction. Finally, the foursurface finishes used in this study all showed the same level of void reduction using the vacuum process while the solderalloy was in the molten phase.

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