Vapour Phase Process

Due to the changes in the machine technology made during the last years, the disadvantages - relative to the conventional technologies of infrared and convection systems - have been eliminated. Because of its continuously superb soldering results the vapour-phase has re-established itself as an acknowledged production process. The new component technologies and the new shapes of component packages will inevitably lead to an increasing use of the vapour-phase technology. Another large field will become the lead-free soldering process. The damage potential in the vapour-phase soldering machines is very low and overheating is impossible. Thus, the pastes with higher liquidus-points may be used without problem in the lead-free soldering process. There is no need to change the printed circuit boards, components, etc