Optimize solder reflow

23/1/2025

A review of these commonly acceptedreflow practices indicates that the surfacemount process often defies generalization. Inmany cases, each process is unique andrequires individually designed methods to satisfy its own requirements. And, of course,there is no substitute for rigorous processcontrol. However, manufacturers are notwithout resources to assist in fine-tuning theirprocesses. To take advantage of rapid developments in advanced technology, assemblersshould work in partnership with all their vendors including suppliers of placement equipment, screen printers, solder paste, conveyors and reflow ovens. The sales and technicalsupport staffs of these companies have experienced literally thousands of applications.Hence, their expertise can provide valuableprocess contributions usually at no cost. Infact, when vendor consultation is combinedwith a manufacturer’s own engineeringresources to challenge commonly acceptedpractices and to optimize process control overeach step in an assembly line, the stage is setfor creating a highly successful operation withhigh productivity levels.

Other publications

Soldering
Kester

The Nature of White Residue on Printed Circuit Assemblies

The problem is not limited only to rosin fluxes and solvent cleaning, but also occurs when water soluble fluxes are used and when either flux type is removed with water. The soldering and cleaning processes involve so many chemicals in the flux, circuit board, components and cleaning agents that a complete understanding of the reactions is very difficult if not impossible. There are white residue problems with water soluble fluxes and many of the causes not related to the flux compositions are the same as for rosin fluxes.
Find out more
Soldering
ASSCON

Multivacuum – the future of soldering

The essential quality features required for these future applications are provided by the multivacuum soldering process. In the multivacuum soldering process assemblies are subjected to several vacuum applications during the soldering process, with the option of applying vacuum processes both before and during the melting of the solder paste.
Find out more
Soldering
Kester

Lead-free SMT Soldering Defects

Tin-Silver-Copper alloys are the primary choice for lead-free SMT assembly. Although there are other options available such as alloys containing bismuth or indium and other elements, tin-silver-copper solders, also known as SAC alloys are by far the most popular. They are used by approximately 65% of users, as last surveyed by Soldertec in 2003.
Find out more